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Utilizing ceramic material development technology, high accurate printing
technology and firing technology, Meiwa developed a multi-printing substrates
(Metalized Substrate) aiming downsizing and high function application.
White and black colors are available.
As a terminal metalization, tungsten paste to be fired in a reduced atmosphere
and precious metals such as Ag/Pd, Ag, etc. to be fired in an air are available.
Meiwa's unique product named "SSM substrate" is most suitable
for high functional CSP transistor (MINI Mold) package. |
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| Material |
Alumina (Aluminum Oxide) 96% |
| Thickness |
0.1mm～1.0mm |
| Outer dimension |
Maximum 120mmSQ |
| Electrode |
W、Ag-Pd、Ag、etc |
| Others |
Capable to print through hole |
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Inquiry
Sales and Business Control Group
Phone +81-561-48-5012, FAX +81-561-48-5058
It is also available for WEB meeting, Skype, SNS(LINE, WeChat, WhatsAPP, Kakao Talk, etc.)
If you want to use it, could you please inform us of you with our phone,
FAX and E-mail( sales@phononmeiwa.co.jp ). We will contact you soon. |
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