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High Density Multi-Printing Ceramic Substrate

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High Density Multi-Printing Ceramic Substrate
Utilizing ceramic material development technology, high accurate printing technology and firing technology, Meiwa developed a multi-printing substrates (Metalized Substrate) aiming downsizing and high function application. White and black colors are available.
As a terminal metalization, tungsten paste to be fired in a reduced atmosphere and precious metals such as Ag/Pd, Ag, etc. to be fired in an air are available.
Meiwa's unique product named "SSM substrate" is most suitable for high functional CSP transistor (MINI Mold) package.

Material Alumina (Aluminum Oxide) 96%
Thickness 0.1mm~1.0mm
Outer dimension Maximum 120mmSQ
Electrode W、Ag-Pd、Ag、etc
Others Capable to print through hole


Inquiry

Sales and Business Control Group
Phone +81-561-48-5012, FAX +81-561-48-5058
E-MAIL info@phononmeiwa.co.jp


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